منابع مشابه
Solder Paste Stencil for Surface Mount Technology
Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium
متن کاملStudy of the Rheological Behaviors of Solder Paste
Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is...
متن کاملHigh Melting Lead-Free Mixed BiAgX Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. The BiAg alloy exhibits acceptable bulk strength, but very poor ductility and wetting. Therefore, it is not acceptable as an option....
متن کاملSolder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications. Over the past 15 years, the implementation of the QFN/BTC package h...
متن کاملReliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components
The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the constructio...
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ژورنال
عنوان ژورنال: ElectroComponent Science and Technology
سال: 1981
ISSN: 0305-3091
DOI: 10.1155/apec.8.21